I NTEGRATED C IRCUITS D IVISION
CPC1510
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020 , in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033 .
Device
CPC1510G / CPC1510GS
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is ESD Sensitive , and should be handled according to the industry standard JESD-625 .
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
CPC1510G / CPC1510GS
Maximum Temperature x Time
250oC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb
e 3
R03
www.ixysic.com
5
相关PDF资料
CPC1540GS RELAY OPTOMOS SP-NO 120MA SMD
CPC1706Y RELAY OPTOMOS DC POWER 4-SIP
CPC1708J RELAY 60VDC 4A I4PAC
CPC1709J RELAY 60VDC 9A ISOPLUS264
CPC1718J RELAY MOSFET 6.75A ISOPLUS-264
CPC1726Y RELAY OPTOMOS DC POWER 4-SIP
CPC1728J RELAY 200VDC I4PAC
CPC1777J RELAY 600VDC I4PAC
相关代理商/技术参数
CPC1510GSTR 功能描述:固态继电器-PCB安装 1-Form-A, Normally-Open Solid State Relay with integrated current limit, Tape/Reel RoHS:否 制造商:Omron Electronics 控制电压范围: 负载电压额定值:40 V 负载电流额定值:120 mA 触点形式:1 Form A (SPST-NO) 输出设备:MOSFET 封装 / 箱体:USOP-4 安装风格:SMD/SMT
CPC1511Y 功能描述:RELAY SSR SPST-NO 450MA 230V 制造商:ixys integrated circuits division 系列:CPC,OptoMOS? 包装:管件 零件状态:在售 电路:SPST-NO(1 A 形) 输出类型:AC,DC 导通电阻(最大值):4 Ohms 负载电流:450mA 电压 - 输入:1.22VDC 电压 - 负载:0V ~ 230V 安装类型:通孔 端子类型:PC 引脚 封装/外壳:4-SIP 供应商器件封装:4-SIP 继电器类型:继电器 标准包装:25
CPC151J 制造商:CORNELL DUBILIER ELECTRONICS 功能描述:Cap Ceramic 150pF 1000V C0G 5% (15 X 4.5mm) Radial 9.5mm 125°C
CPC1540G 功能描述:IC RELAY SP-NO 120MA SMD 制造商:ixys integrated circuits division 系列:* 零件状态:有效 标准包装:50
CPC1540GS 功能描述:RELAY OPTOMOS SP-NO 120MA SMD RoHS:是 类别:继电器 >> 固态 系列:CPC, OptoMOS® 标准包装:2 系列:DP 电路:SPST-NO(1 Form A) 输出类型:DC 导通状态电阻:14 毫欧 负载电流:20A 输入电压:4.5 ~ 15VDC 电压 - 负载:1 ~ 48 V 安装类型:底座安装或面板安装 端接类型:螺丝端子 封装/外壳:Hockey Puck 供应商设备封装:- 包装:散装 继电器类型:接触器 其它名称:CC1832
CPC1540GSTR 制造商:IXYS Integrated Circuits Division 功能描述:Relay SSR 10mA 1.4V DC-IN 0.12A 350V AC/DC-OUT 6-Pin SMD T/R
CPC1560 制造商:CLARE 制造商全称:Clare, Inc. 功能描述:Solid State Relay with Integrated Current Limit
CPC1560G 功能描述:固态继电器-PCB安装 1-Form-A, Normally-Open Solid State Relay with integrated current limit RoHS:否 制造商:Omron Electronics 控制电压范围: 负载电压额定值:40 V 负载电流额定值:120 mA 触点形式:1 Form A (SPST-NO) 输出设备:MOSFET 封装 / 箱体:USOP-4 安装风格:SMD/SMT